MediaTek has officially introduced the Dimensity 9400, its most advanced mobile chipset. Manufactured using TSMC’s 3nm process, the company claims this latest chipset offers “up to 40 percent more power efficiency” than its predecessor.
The octa-core chipset includes a 3.62GHz ARM Cortex-X295 core, three ARM Cortex-X4 cores, and four Cortex-A720 cores. While the Cortex-X295 is a new addition, the other two cores were revealed last year at Computex.
MediaTek asserts that this new configuration provides a 35 per cent boost in single-core performance and a 28 per cent increase in multi-core performance compared to the previous model. On the graphics front, the updated ARM 12-core Immortalis-G295 GPU delivers up to 40 per cent greater ray tracing performance.
The Dimensity 9400 also features enhancements to its NPU, offering “80 per cent faster large language model prompt performance” and enabling AI video generation and the development of agentic applications. The chipset allows for content scaling for tri-fold smartphones like the Huawei Mate XT Ultimate Edition.
Regarding video capabilities, the chipset supports recording in 8K at 60fps and full-range HDR zoom for compatible devices. For connectivity, MediaTek has updated the 5G modem to achieve speeds of up to 7 Gbps, along with a new 4nm Wi-Fi/Bluetooth combo chip that reduces power consumption.
The MediaTek Dimensity 9400 is set to launch in Q4 of 2024, with the Vivo X200 series, debuting in China on October 14, being the first smartphone to feature this new chipset.
